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Stariver ELectronics(HK)Co.,Ltd.
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 Click to enlarge image
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 Model Number |
SR-F008 |
Layer: 2-layers
Material: 35/25/35um PI, RA
Solder mask: 25um PI coverlay
Surface: Immersion gold
Stiffeners: FR4, 1.0mm
FPCB production capabilities:
Layer count: Single & Double-sided and multilayer (3~6Layer)
Base material: PI, PE, PET
Thick. Of base copper: 12μm, 18μm, 35μm, 70μm
Largest Panel Size: 400mm x 600mm
Minimum hole dimension:
**Drilling(P. T. H. ): Φ0.2mm
** Punching: Φ0.5mm
PTH tolerance: +/-0.1mm
NPTH tolerance: +/-0.05mm
Minimum line width: 0.1mm
Minimum line space: 0.1mm
Surface treatment: Immersion Gold/Tin/Silver, Gold Plating, OSP
Profile treatment: V-Cut, punching and milled
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